Precision Tsib Axis CNC Semiconductor Nqus Chamber Specs

Precision Tsib Axis CNC Semiconductor Nqus Chamber Specs
Paub meej:
Cov kev pabcuam: 5-axis CNC milling thiab tig-milling rau monolithic lub tshuab nqus tsev thiab cov khoom siv sab hauv.

Peev Xwm: Lub thawv, kheej kheej, thiab cylindrical chamber machining hnab ntawv mus txog 1800 × 1500 × 800 mm.

Ua tiav: Electropolishing rau Ra 0.2 µm, daim iav milling, hlaws blasting, passivation, thiab nyuaj anodizing.

Specifications: Dimensional kam rau ua rau ± 0.005 hli nrog siab -precision O- nplhaib zawj thiab CF riam- ntug profiles.

Kev Tswj Xyuas Zoo: Pfeiffer helium mass spectrometry leak detection, OES spectral material checks, thiab optical profiling.

Lub Sijhawm Lead: 15-hnub xa khoom rau cov qauv tsim thiab 30-40 hnub rau cov chav ua haujlwm UHV tag nrho.

MOQ: Yam tsawg kawg nkaus txiav txim kom muaj nuj nqis pib ntawm 1 unit rau prototyping mus txog ntim ntau lawm.

Drawings: Direct processing of STEP, IGS, X_T, DWG, thiab PDF 2D/3D CAD cov ntaub ntawv.

Tus nqi-Ntxiv: Cov kev ntxhov siab thermal-Nyob rau hauv annealing, cleanroom ultrasonic ntxuav, thiab muab ob npaug rau lub tshuab nqus tsev ntim.
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5 Axis CNC Machining Semiconductor Vacuum Chamber Engineering Specifications

Monolithic milled nqus tsev enclosures engineered rau xoom- tsis xws luag lub tshuab nqus tsev vacuum, tsis tshua muaj outgassing, thiab ntev- lub sij hawm seem stability.

Core Engineering nta:

Helium leak rate Tsawg dua lossis sib npaug li 1 × 10^-12 Pa·m³ / s nrog 100% cov ntawv tshaj tawm.

Austenitic stainless hlau 304/316L thiab 6061-T6 aluminium alloys.

Ultra siab nqus chamber fabrication mus rau 10^-9 Pa.

Flange sealing nto flatness kam rau ua nyob rau hauv tsawg dua los yog sib npaug rau 0.02 mm / m.

Semiconductor load xauv chamber tsim nrog kev ntxhov siab.

15-hnub prototype turnaround rau engineering ntsuam xyuas qauv.

Zeiss CMM validated siab precision cnc machining semiconductor qhov chaw.

 

PVD Deposition System Vacuum Chamber

 

Monoblock Milling Peev Xwm rau Semiconductor Vacuum Chambers

Tshem tawm cov txheej txheem welds kom ua tiav helium-cov ntsaws ruaj ruaj thiab cov khoom siv zoo tshaj plaws hauv cov txheej txheem.

 

Xiamen Dazao Machinery tsim monoblock5-axis CNC machined semiconductor nqus tsev vacuumtsim los rau lub tshuab nqus tsev siab (HV) thiab ultra-lub tshuab nqus tsev siab (UHV). Siv ntau-axis tig thiab 5-axis ib txhij CNC milling chaw, cov khoom siv ntawm stainless hlau 304, 316L, thiab Al6061-T6 tau hloov mus rau hauv lub tshuab nqus tsev uas tsis muaj cov qauv welds.

 

Peb lub peev xwm tsim khoom txhawb nqa lub npov- zoo li PVD deposition chambers, plasma etching chambers, wafer load lock modules, thiab spherical UHV cov hlab ntsha. Los ntawm kev tshem tawm cov porosity sab hauv, cov khoom voids, thiab cua sov- cuam tshuam thaj chaw weld tsis xws luag, peb5 Axis CNC Machining Semiconductor Nqus Chambertxheej txheem xa cov ciam teb ruaj khov, txuas ntxiv hauv cov cua txias, thiab cuam tshuam -dawb flange ntsej muag rau cov neeg tsim khoom thoob ntiaj teb.

Vacuum Chamber Housing Parts For Semiconductor Equipment

 

Field Failure Analysis thiab Engineering Corrective Actions

Tiag -lub ntiaj teb engineering hauv paus ua rau kev tshuaj xyuas los ntawm cov khoom siv semiconductor kev teeb tsa.

 

1: PVD Deposition Chamber Flange Micro-Leakage Rectification

 

· Keeb kwm:Ib tug European nyias- cov neeg siv khoom siv zaj duab xis tau ntsib 30% tsis ua haujlwm thaum lub sijhawm kuaj helium rau ntawm lub thawv- zoo li stainless hlau PVD chambers machined los ntawm cov neeg muag khoom qub txeeg qub teg. Kev soj ntsuam tsis ua tiav tau qhia pom cov cim me me thiab cov flange flatness sib txawv tshaj 0.05 hli hla lub ntsej muag sealing.

 

· Engineering Action:Peb tau qhia txog daim iav milling siv lub ntsej muag tshwj xeeb -milling cutter geometry ua raws li qhov tseeb ntawm tes lapping. Nto flatness tau coj los nyob rau hauv tsawg dua los yog sib npaug rau 0.02 mm / m thiab roughness raug txo mus rau Ra 0.4 µm. Txhuaprecision machined stainless hlau Cheebtsamkhiav tam sim no dhau 100% helium huab hwm coj spectrometer kuaj ua ntej xa khoom, nce kev lees paub los ua ke rau 100%.

 

2: Outgassing Mitigation hauv Spherical UHV Reaction Vessels

 

· Keeb kwm:Ib lub koom haum tshawb fawb tau tshaj tawm cov kev ntxhov siab nyob rau ntawm 10^-7 Pa hauv ib lub raj kheej kheej uhv chamber nrog cf flanges ua los ntawm tus qauv SS304. High outgassing tus nqi los ntawm sab hauv qhov chaw muaj kab mob thiab daig noo noo tiv thaiv twj tso kua mis-down mus rau qhov yuav tsum tau 10^-9 Pa theem.

 

· Engineering Action:Peb hloov cov khoom specification rau qis-carbon SS316L, sib xyaw ua ke 900℃nqus tsev vacuum annealing degas voj voog, thiab siv cov electropolishing sab hauv kom qis qhov roughness rau Ra Less tshaj los yog sib npaug rau 0.2 µm. Tom qab ntxuav chav ntxhua khaub ncaws ultrasonic thiab lub tshuab nqus tsev vacuum, lub tshuab nqus tsev qhov kawg mus txog 10^-9 Pa hauv qhov tshwj xeeb.

 

3: Load Lock Chamber Flange Warping Nyob rau hauv siab Cycling

 

· Keeb kwm:Ib lub chaw tsim khoom siv wafer tau kuaj pom qhov poob qis hauv cov khoom siv hluav taws xob semiconductor lock chamber tsim tom qab rau lub hlis ua haujlwm. Lub qhov cua nrawm-rau- lub tshuab nqus tsev siab lub voj voog tso tawm qhov seem machining kev ntxhov siab, warping lub ntsiab sealing qhov rooj flange los ntawm 0.03 hli.

 

· Engineering Action:Peb tau teeb tsa ob-theem kev ntxhov siab rau cov txheej txheem: ntxhib milling → thermal annealing → semi-finishing → Secondary thermal stabilization → 5-axis tiav milling nrog cov cuab yeej- txoj kev micro- nyiaj pab. Tom qab hloov kho qhov rooj xauv qhov rooj nthuav tawm warp Tsawg dua lossis sib npaug li 0.01 hli tom qab 10,000 lub voj voog siab.

Custom Stainless Steel Vacuum Chamber

 

Technical Differentiators rau Ultra-High Vacuum Fabrication

Txheem metallurgical thiab kuaj workflows uas cais cov semiconductor -qib chav los ntawm cov khw muag khoom lag luam.

 

1. Qib Nqus Sealing & 100% Helium Leak Validation:

· High Vacuum (HV) Standard:Helium leak rate Tsawg dua lossis sib npaug li 1 × 10^-10 Pa·m³ / s. Optimized rau PVD systems, load locks, thiab hloov modules.

· Ultra{0}}High Vacuum (UHV) Standard:Helium leak rate Tsawg dua lossis sib npaug li 1 × 10^-12 Pa·m³ / s. Formulated rau plasma etching thiab nto tsom xam tshuab.

 

2. UHV Material Outgassing Control Protocol:

· Khoom siv ntau traceability nrog tsawg vapor siab alloy xaiv (SS316L, Al6061-T6).

· High-nqus thermal degas kev ua haujlwm tshem tawm hydrogen absorbed los ntawm cov hlau lattices.

· Electropolishing txo qhov micro- porosity thiab qhov chaw nqus ntawm qhov chaw.

 

3. Cyclic Load Stress Stabilization:

· Muab ob npaug rau-theem thermal annealing tshem tawm cov seem machining stresses.

· Toolpath them nyiaj tiv thaiv cov qauv deflection nyob rau hauv atmospheric siab loads.

Plasma Etching Chamber Semiconductor Equipment

 

Kev sib piv: Monoblock 5-Axis Milling vs. Welded Assemblies

Kev ntsuas ntau ntawm lub tshuab nqus tsev, qhov tseeb, thiab ntev - cov nqi khiav lag luam.

 

Kev ntsuas ntsuas

Monoblock 5-Axis CNC Milling

Welded Sheet Hlau los ua ke

Cov qauv & txheej txheem cuam tshuam

Vacuum Leak Risk

Zero internal weld seams; khoom geometry

Kev pheej hmoo siab ntawm tshav kub- thaj chaw cuam tshuam (HAZ) cov kab txuas

Tiv thaiv kev qaug zog tawg thaum lub sij hawm lub tshuab nqus tsev tsis tu ncua

Flange Flatness

Flatness Tsawg dua lossis sib npaug ntawm 0.02 mm / m; bores tuav rau ± 0.005 hli

Thermal deformation distorts flatness tshaj 0.10 hli

Xyuas kom meej wafer hloov neeg hlau caj npab sib dhos

Outgassing Rate

Tsawg qhov chaw; electropolished Ra Tsawg dua los yog sib npaug rau 0.2 µm

High outgassing los ntawm ntxhib weld seams & flux inclusions

Accelerates chamber twj tso kua mis- mus rau qhov kawg ntawm lub tshuab nqus tsev

Sab hauv Channel

Monolithic fluid channels & complex ports

Sab nraud welded kua kab & welded manifolds

Tiv thaiv cov dej txias hauv cov dej ntws tawm hauv lub tshuab nqus tsev ciam teb

Prototyping Lead Time

Direct CAD-rau-CNC milling yam tsis muaj cuab yeej nyuaj

Yuav tsum tau vuam fixtures, xovxwm cov cuab yeej, thiab alignment jigs

Txo cov txheej txheem engineering iteration ncua sij hawm rau cov cuab yeej tshiab

Rau cov ntawv thov uas xav tau kev tswj xyuas kom zoo los yog kev tiv thaiv corrosion, peb cov ntawv tshaj tawm -machining peev xwm suav nrog ntawv pov thawjnyuaj coat anodizing thiab electropolishingcov kev xaiv txuam nrog cov txheej txheem toolmaker.

Ion Implantation Vacuum Chamber

 

Technical Specifications Table

Rig tolerances, nto tiav, thiab soj ntsuam cov qauv rau lub tshuab nqus tsev vacuum.

 

Qeb Parameter

High Vacuum (HV) Standard

Ultra-High Vacuum (UHV) Standard

Cov khoom xaiv

SS304, Al6061-T6, Al7075-T6

SS316L (Low Carbon), Titanium Qib 2

Lub hnab ntawv loj tshaj plaws

1800mm × 1500mm × 800mm

1200 mm Spherical / Cylindrical hnab ntawv

Flange Flatness

Tsawg dua lossis sib npaug li 0.02 mm / m

Tsawg dua lossis sib npaug li 0.01 mm / m

Machining Tolerances

± 0.010 hli

± 0.005 hli

Surface Finish (Internal)

Ra 0.8 µm (Raws li -milled / Bead blasted)

Ra 0.2 µm (Electropolished)

Helium Leak Rate

Tsawg dua lossis sib npaug li 1 × 10^-10 Pa·m³/s

Tsawg dua lossis sib npaug li 1 × 10^-12 Pa·m³/s

Base Kev Ua Haujlwm Siab

Mus txog 10^-7 Pa

Mus txog 10^-9 Pa

Cov cuab yeej siv tshuab

5-Axis Simultaneous Milling, Turn-milling

5-Axis Gantry Milling, Jig Sib Tsoo

Cov ntaub ntawv zoo

CMM Inspection Report, Cov ntaub ntawv pov thawj (EN 10204 3.1)

Helium Leak Detector Logs, Outgassing Data

Spherical UHV Chamber with CF Flanges

 

Quality Assurance & Inspection Standards

Kev txheeb xyuas cov txheej txheem kom ntseeg tau ncaj qha kev koom ua ke rau hauv semiconductor fab kab.

 

Peb cov kev tsim khoom lag luam ua haujlwm raws li ISO 9001: 2015 ntawv pov thawj kev tswj hwm zoo. Kev soj ntsuam raws tu qauv npog txhua theem ntawm chamber fabrication:

 

· Kev tshuaj xyuas cov khoom:Cov khoom lag luam tuaj ntau dhau los ua pov thawj tshuaj ntawm Optical Emission Spectroscopy (OES). Ultrasonic kuaj xyuas xoom sab hauv void tsim nyob rau hauv tuab extrusion.

 

· Thawj Tsab Ntawv Tshuaj Ntsuam Xyuas (FAI):FAI daim ntawv qhia qhov ntev yog tsim los siv Zeiss CMM cov cuab yeej ua ntej tso tawm tag nrho cov khoom tsim tawm.

 

· Hauv -Cov Txheej Txheem Kev Ntsuam Xyuas:Qhov tseem ceeb sealing qhov ntev, O-ring zawj geometry, thiab ConFlat (CF) riam- ntug profiles raug txheeb xyuas thaum lub sijhawm ua haujlwm milling.

 

· 100% Helium Leak Testing:Txhua lub thawv zoo li lub tshuab nqus tsev siab dhau los ua pov thawj los ntawm Pfeiffer Helium Mass Spectrometer Leak Detectors ua haujlwm hauv lub tshuab nqus tsev.

 

· Ntim Ntim:Cov khoom siv ultrasonic tu nrog dej deionized, nqus tsev vacuum degas, muab ob npaug rau polyethylene hnab ntim rau hauv chav huv huv, thiab kev tiv thaiv crating.

Aluminum Semiconductor Vacuum Chamber Manufacturer

 

Khoom thiab Geometry Xaiv Matrix

Sib piv cov khoom siv thiab cov qauv duab los ua cov khoom siv roj av thiab lub tshuab nqus tsev.

 

Stainless hlau 304 / 316L:Selected for operating bakeout temperatures >200 degree, reactive txheej txheem chemistry, thiab qhov kawg lub tshuab nqus tsev yuav tsum qis dua 10^-7 Pa. SS316L yog teev rau chlorine thiab fluorine plasma etching txheej txheem.

 

Aluminium 6061-T6:Siv qhov chaw thermal dissipation, txo qhov hnyav rau cov neeg hlau wafer handlers, thiab cov twj tso kua mis ceev ceev - yuav tsum tau mus. Aluminium oxide nto passivation muab ib qho kev tawm tsam zoo.

 

· Box / Rectangular Enclosures:Muab qhov siab tshaj plaws hauv substrate loading ntim. Pom zoo rau pvd deposition system nqus chamber tsim thiab automated hloov modules.

 

· Spherical / Cylindrical Enclosures:Distributes structural siab stresses tusyees nyob rau hauv tag nrho atmospheric txawv loads. Zoo tagnrho rau spherical uhv chamber nrog cf flanges kev khiav hauj lwm nyob rau hauv scientific thiab nto tsom xam teb.

 

Target Application Industries

Ua haujlwm thoob ntiaj teb semiconductor OEMs, txheej txheej cov cuab yeej tsim, thiab cov chaw tshawb fawb tshawb fawb.

Semiconductor Wafer Processing

Semiconductor Wafer ua

Kev tsim cov plasma etching chamber semiconductor khoom, CVD enclosures, thiab ion beam modules.

PVD Thin-Film Deposition

PVD Nyias -Ntev zaj duab xis

Monolithic chamber lub cev nrog kev sib koom ua ke lub hom phiaj flanges thiab sab hauv txias rau sputtering systems.

UHV Research Laboratories

UHV Research Laboratories

Kev cai UHV chambers tsim rau synchrotron lub teeb qhov chaw, nto physics, thiab particle acceleration systems.

Tool Maintenance & Refurbishment

Cov cuab yeej tu & kho dua tshiab

Re-machining thiab meej- haum hloov ntawmprecision CNC tshuab nqus tsev chamber Cheebtsamrau legacy wafer fab kab.

Tau Txais Daim Ntawv Tso Cai rau Semiconductor Vacuum Chamber

FAQs

 

 

Box Shaped High Vacuum Chamber

01.Yuav ua li cas koj paub qhov txawv ntawm lub tshuab nqus tsev vacuum tiag tiag thiab cov khoom outgassing thaum kuaj?

Kev paub qhov txawv txav ntawm cov dej xau los ntawm qhov tseeb yuav tsum tau ntsuas qhov ntsuas siab thiab ntsuas roj seem (RGA). Outgassing (feem ntau yog dej vapor) ua rau lub twj tso kua mis- nqes nkhaus kom flatten tawm ntawm qhov nruab nrab siab, tab sis siab nce qib tawm thaum lub sijhawm sib cais. Qhov tseeb atmospheric xau qhia tau hais tias ib tug nruam, linear siab nce. Peb daws outgassing siv lub tshuab nqus tsev annealing thiab electropolishing, thiab paub meej tias qhov tseeb xoom-txoj cai los ntawm helium huab hwm coj spectrometry.

02.Vim li cas xaiv aluminium 6061-T6 tshaj stainless hlau rau semiconductor nqus tsev?

Raws li tau hais tseg hauv kev sib tham txog kev tsim vaj tsev, txhuas muaj 3 × qis dua, thermal conductivity zoo dua, thiab rov ua dua sai dua li cov hlau tsis muaj steel. Aluminium ib txwm ua rau saum npoo ntawm aluminium oxide barrier uas nthuav tawm tsis tshua muaj hydrogen permeation, txo qis outgassing nyob rau hauv lub tshuab nqus tsev siab thaum txo cov cuab yeej hnyav thiab machining nqi.

03.Koj ua li cas tiv thaiv kev puas tsuaj thiab burrs ntawm ConFlat (CF) riam -ntug flanges thaum lub sij hawm 5-axis machining?

CF riam- ntug sealing daim di ncauj yuav tsum muaj tseeb 90℃ntse profiles nrog xoom chatter cim kom tom huv si rau hauv oxygen-dawb tooj liab gaskets. Peb siv cov cuab yeej tshwj xeeb kev cai txiav cov cuab yeej, ultra- cov khoom ua tiav zoo, thiab daim iav milling hla dhau. Txhua lub riam ntug tau dhau 100% kev tshuaj ntsuam xyuas qhov muag kom pom tseeb tias tsis muaj micro-burrs lossis ntug rollover.

04.Vim li cas lub tshuab nqus tsev tuaj yeem dhau qhov kev soj ntsuam zoo li CMM tab sis ua tsis tiav helium xau kuaj?

Cov tshuab ntsuas kev sib koom tes zoo li qub (CMM) ntsuas macro-geometry tab sis tsis tuaj yeem ntes micro-porosity, pub- cim txuas txuas ntxiv hla lub ntsej muag sib khi, lossis sub-micron nto chatter. Helium atoms nkag mus rau micro-grooves uas hla dhau CMM kov sojntsuam. Peb muab daim iav milling nrog 100% helium mass spectrometer kuaj nyob rau hauv tag nrho lub tshuab nqus tsev khiav tawm.

05.Dab tsi tiv thaiv load xauv chamber flanges los ntawm warping thaum lub sij hawm nquag caij tsheb kauj vab?

Qhov cua-rau- lub tshuab nqus tsev siab lub tshuab nqus tsev exerts cyclic mechanical fatigue thiab unlocks residual stresses sab laug los ntawm hnyav hnyav milling. Peb tshem tawm qhov kev pheej hmoo no los ntawm kev siv ntau-theem kev ntxhov siab nyem annealing ntawm ntxhib milling, semi-finishing, thiab zaum kawg 5-axis precision finishing passes, kom ntseeg tau ntev geometric stability nyob rau hauv atmospheric differential loads.

06.Internal deg roughness (Ra) cuam tshuam li cas lub tshuab nqus tsev siab?

Rougher nto muaj microscopic peaks thiab kwj ha uas ntxiab atmospheric ya raws thiab cov txheej txheem gases, ua kom ntau outgassing cheeb tsam. Electropolishing internal chamber phab ntsa los ntawm Ra 0.8 µm mus rau Ra 0.2 µm txo cov micro- thaj tsam saum npoo los txog li 80%, ua kom cov twj tso kua mis chamber- nqes mus txog qhov kawg UHV siab.

Thov Kev Ntsuam Xyuas DFM rau Koj Qhov Kev Tsim Kho Semiconductor Chamber Design

Xa koj 2D engineering drawings thiab 3D CAD cov ntaub ntawv (STEP, IGES, X_T) rau kev ntsuam xyuas engineering.

Peb pab pawg kws tshaj lij xa cov ncauj lus kom ntxaws Tsim rau Manufacturability (DFM) cov lus tawm tswv yim thiab cov ntawv tshaj tawm kev lag luam hauv 24 teev.

Direct Technical Email: Erica@dazaocn.com

 

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Request a DFM Evaluation for Your Semiconductor Chamber Design

Cim npe nrov: 5 Axis CNC Machining Semiconductor Nqus Chamber, ultra siab nqus chamber fabrication, semiconductor load xauv chamber tsim, lub thawv zoo li lub tshuab nqus tsev siab chamber, kheej kheej uhv chamber nrog cf flanges

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